Tungsten-Copper Heat Sinks

tungsten copper heat sinks

They are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.

Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.

Advantages

  • High thermal conductivity
  • Excellent hermeticity
  • Excellent flatness, surface finish, and size control
  • Semi-finished or finished (Ni/Au plated) products available

Technical Data

Type Composition Properties
? Tungsten Content (wt %) Density (g/cm3) CTE (ppm/K) Thermal Conductivity (W/m.K)
W90Cu 90 ± 1 17.0 6.5 180 - 190
W85Cu 85 ± 1 16.3 7.0 190 - 200
W80Cu 80 ± 1 15.6 8.3 200 - 210
W75Cu 75 ± 1 14.9 9.0 220 - 230
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